MPC5534MVM80 vs MPC5554MZP112 Comparison

This in-depth comparison of the MPC5534MVM80 and MPC5554MZP112 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
MPC5534MVM80

+BOM

5899 PCS | NXP USA Inc.
MPC5554MZP112

+BOM

6683 PCS | NXP USA Inc.
Package BGA-208 BBGA-416
Description IC MCU 32BIT 1MB FLASH 208MAPBGA IC MCU 32BIT 2MB FLASH 416PBGA
Supplier - NXP USA Inc.
Series MPC55xx Qorivva MPC55xx Qorivva
Part Status Not For New Designs Not For New Designs
Core Processor e200z6 e200z6
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 112MHz
Connectivity CANbus, EBI/EMI, Ethernet, SCI, SPI CANbus, EBI/EMI, SCI, SPI
Peripherals DMA, POR, PWM, WDT DMA, POR, PWM, WDT
Number of I/O 192 256
Program Memory Size 1MB (1M x 8) 2MB (2M x 8)
Program Memory Type FLASH FLASH
RAM Size 64K x 8 64K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V 1.35V ~ 1.65V
Data Converters A/D 34x12b A/D 40x12b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Comparison Model : MPC5534MVM80 MPC5554MZP112

+BOM RFQ