MPC5534MVM80 vs MPC555LFMZP40R2

This in-depth comparison of the MPC5534MVM80 and MPC555LFMZP40R2 provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Parts at a glance

Part A

MPC5534MVM80

NXP USA Inc.

Lifecycle
Active
Stock
5899 PCS
Package
BGA-208
Series
Embedded - Microcontrollers
+BOM RFQ
Part B

MPC555LFMZP40R2

NXP USA Inc.

Lifecycle
Active
Stock
9113 PCS
Package
BBGA-272
Series
Embedded - Microcontrollers
+BOM RFQ

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification MPC5534MVM80 MPC555LFMZP40R2
Supplier - NXP USA Inc.
Series MPC55xx Qorivva MPC5xx
Part Status Not For New Designs Obsolete
Core Processor e200z6 PowerPC
Core Size 32-Bit Single-Core 32-Bit Single-Core
Speed 80MHz 40MHz
Connectivity CANbus, EBI/EMI, Ethernet, SCI, SPI CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals DMA, POR, PWM, WDT POR, PWM, WDT
Number of I/O 192 101
Program Memory Size 1MB (1M x 8) 448KB (448K x 8)
Program Memory Type FLASH FLASH
RAM Size 64K x 8 26K x 8
Voltage - Supply (Vcc/Vdd) 1.35V ~ 1.65V 2.7V ~ 5.5V
Data Converters A/D 34x12b A/D 32x10b
Oscillator Type External External
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 125°C (TA)
Mounting Type Surface Mount Surface Mount
Compare RFQ