5CEFA9F23I7N vs 5CEFA4F23C7N

This in-depth comparison of the 5CEFA9F23I7N and 5CEFA4F23C7N provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application.

Technical review by ETEI Component Engineering Source: manufacturer documentation

Replacement verdict

Compatible functional replacement candidate

The 5CEFA4F23C7N is a viable functional replacement candidate for the 5CEFA9F23I7N only when reduced logic density, lower transceiver count, and commercial temperature operation are acceptable. The 5CEFA9F23I7N offers significantly higher logic capacity and industrial temperature support, so the substitution is not a true drop-in replacement. Designers must validate resource utilization, transceiver requirements, and thermal margins before committing to the swap.

Logic Density Validation required
Transceiver Count Validation required
Package Type High match
Operating Temperature Not compatible

Parts at a glance

Part A

5CEFA9F23I7N

Intel

Lifecycle
Active
Stock
4366 PCS
Package
BGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)
Part B

5CEFA4F23C7N

Intel

Lifecycle
Active
Stock
9311 PCS
Package
BGA-484
Series
Embedded - FPGAs (Field Programmable Gate Array)

Key differences

Rows are prioritized by design impact. Highlighted values require attention during substitution.

Key electrical and mechanical differences between the two devices

Parameter 5CEFA9F23I7N 5CEFA4F23C7N Why it matters
Logic Elements (LE) 301000 49000 Logic element count determines the amount of programmable logic available for implementing user designs; a large mismatch means the two devices are not functionally interchangeable for complex designs.
Total RAM Bits 14251008 3080192 Embedded memory capacity limits data buffering, FIFO depth, and on-chip storage; designs requiring large memory cannot be ported to the smaller device.
Number of I/Os 480 480 I/O count affects how many external signals can be interfaced; matching I/O counts support similar board-level connectivity.
Operating Temperature Range -40°C to 100°C (TJ) 0°C to 85°C (TJ) The industrial temperature grade of the first device supports harsher environments, while the commercial grade of the second is limited to benign conditions.
Speed Grade 7 (fastest) 7 (fastest) Speed grade determines maximum operating frequency and timing closure margins; identical grades mean comparable performance per logic element.
Package / Case FBGA-484 FBGA-484 Package compatibility is essential for physical board replacement; identical packages allow the same PCB footprint.
Supply Voltage 1.1 V core 1.1 V core Core voltage must match the board power design; identical values simplify power supply reuse.
Number of PLLs 8 4 PLL count limits clock generation and synchronization resources; fewer PLLs restrict complex clocking schemes.
Embedded Multipliers (18x18) 684 112 DSP block count determines arithmetic throughput for signal processing; a large difference prevents direct substitution in DSP-heavy applications.

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Full specification comparison

Use manufacturer datasheets as the final authority.

Specification 5CEFA9F23I7N 5CEFA4F23C7N
Supplier - Intel
Series Cyclone® V E Cyclone® V E
Part Status Active Active
Number of LABs/CLBs 113560 18480
Number of Logic Elements/Cells 301000 49000
Total RAM Bits 14251008 3464192
Number of I/O 224 224
Voltage - Supply 1.07V ~ 1.13V 1.07V ~ 1.13V
Mounting Type Surface Mount Surface Mount
Operating Temperature -40°C ~ 100°C (TJ) 0°C ~ 85°C (TJ)

Frequently asked questions

What are the key differences between the 5CEFA9F23I7N and the 5CEFA4F23C7N?

The 5CEFA9F23I7N and 5CEFA4F23C7N are both Intel (formerly Altera) Cyclone V FPGAs in the same 484-pin FBGA package (F23). The primary differences are logic density, speed grade, and operating temperature range. The 5CEFA9F23I7N offers higher logic density (approximately 301K logic elements) and is rated for industrial temperature range (-40°C to 100°C junction), while the 5CEFA4F23C7N has lower logic density (approximately 49K logic elements) and is rated for commercial temperature range (0°C to 85°C junction).

Are the 5CEFA9F23I7N and 5CEFA4F23C7N pin-to-pin compatible?

Both devices are offered in the same 484-pin FBGA package (F23), which means they share the same physical footprint and ball grid. However, pin-to-pin compatibility in terms of function depends on the specific I/O assignments and transceiver configurations defined in the design. Designers must verify pin assignments against the respective device pinout files and datasheets before considering a swap.

What is the logic density difference between the 5CEFA9F23I7N and the 5CEFA4F23C7N?

The 5CEFA9F23I7N belongs to the Cyclone V E A9 density grade, which provides approximately 301,000 logic elements (LEs). The 5CEFA4F23C7N belongs to the Cyclone V E A4 density grade, which provides approximately 49,000 LEs. This represents roughly a six-fold difference in logic capacity, making the A9 device suitable for significantly more complex designs.

What do the speed grade and temperature suffixes indicate for these two devices?

In the part number 5CEFA9F23I7N, the "I7" indicates an industrial temperature grade (-40°C to 100°C junction) and speed grade 7. In 5CEFA4F23C7N, the "C7" indicates a commercial temperature grade (0°C to 85°C junction) and speed grade 7. Both devices share the same speed grade 7, but differ in their rated operating temperature ranges.

Can the 5CEFA4F23C7N be used as a drop-in replacement for the 5CEFA9F23I7N?

No. Although both devices share the same 484-pin FBGA package, they differ in logic density, temperature grade, and potentially in available hard IP blocks and I/O resources. A drop-in replacement would require a complete redesign, recompilation, and validation of the FPGA configuration, as well as verification that the target application's logic utilization fits within the smaller A4 device and that the commercial temperature range is acceptable.

Do both devices support the same transceiver and I/O standards?

Both the 5CEFA9F23I7N and 5CEFA4F23C7N are Cyclone V E family devices and support a similar range of I/O standards and transceiver capabilities as defined by the Cyclone V device family. However, the number of available transceiver channels, PLLs, and memory blocks may differ between density grades. Designers must consult the Cyclone V Device Handbook and the respective device pinout files to confirm exact resource availability for each specific part number.

Which device is more suitable for high-reliability or industrial applications?

The 5CEFA9F23I7N is rated for industrial temperature range (-40°C to 100°C junction), making it more suitable for industrial, automotive, and high-reliability applications that require extended temperature operation. The 5CEFA4F23C7N is rated for commercial temperature range (0°C to 85°C junction) and is better suited for consumer or office-grade environments where temperature extremes are not a concern.

What configuration options are available for these Cyclone V FPGAs?

Both the 5CEFA9F23I7N and 5CEFA4F23C7N support standard Cyclone V configuration schemes, including active serial (AS), passive serial (PS), fast passive parallel (FPP), and JTAG configuration. Configuration data is stored in external flash memory or provided by an external host. The configuration file size differs between the two devices due to the difference in logic density, so the external configuration memory must be sized accordingly.