FDG6301N vs FDG6302P Comparison

This in-depth comparison of the FDG6301N and FDG6302P provides valuable insights into their specifications and key features. We cover important factors in detail, including RoHS compliance, REACH status, series, mounting style, package type, and other relevant characteristics. Presenting the differences side by side simplifies component selection, making it easier for you to select the best option for your specific application. For more information, refer to their datasheets or contact our sales team for assistance in selecting the right part for your design.
Specifications
FDG6301N

+BOM

7191 PCS | onsemi
FDG6302P

+BOM

5604 PCS | onsemi
Package SC-88
Description MOSFET 2N-CH 25V 0.22A SC88 MOSFET 2P-CH 25V 0.14A SC70-6
Supplier - onsemi
Part Status Obsolete Obsolete
FET Type - 2 P-Channel (Dual)
FET Feature Logic Level Gate Logic Level Gate
Drain to Source Voltage (Vdss) 25V 25V
Current - Continuous Drain(Id) @ 25°C - 140mA
Rds On(Max) @ Id Vgs - 10Ohm @ 140mA, 4.5V
Vgs(th)(Max) @ Id - 1.5V @ 250µA
Gate Charge(Qg)(Max) @ Vgs - 0.31nC @ 4.5V
Input Capacitance(Ciss)(Max) @ Vds - 12pF @ 10V
Power - Max 300mW 300mW
Operating Temperature -55°C ~ 150°C (TJ) -55°C ~ 150°C (TJ)
Mounting Type Surface Mount Surface Mount
Base Product Number FDG6301 -
Technology MOSFET (Metal Oxide) -
Configuration 2 N-Channel (Dual) -
Current - Continuous Drain (Id) @ 25°C 220mA -
Rds On (Max) @ Id, Vgs 4Ohm @ 220mA, 4.5V -
Vgs(th) (Max) @ Id 1.5V @ 250µA -
Gate Charge (Qg) (Max) @ Vgs 0.4nC @ 4.5V -
Input Capacitance (Ciss) (Max) @ Vds 9.5pF @ 10V -
Packaging Cut Tape (CT), Tape & Reel (TR) -
Comparison Model : FDG6301N FDG6302P

+BOM RFQ